Chosen Solution
Hello again ifixit. Im just learning how to do BGA work and micro soldering and such. I had a quick question of replacing the U2 IC on an iPhone 5s, how do you go about lining up the new chip? It doesn’t seem to want to sit correctly on the board connections, it keeps sliding to the side when I go to heat it up and if I put pressure on it, it immediately slips. Is there someone to clean up the board connections after removing the old chip? I had tried using desoldering wick to clean them up, but on a board i have tried that on before, it ended up pulling a couple of the connections away from the board. And I don’t want to do that as it seems impossible to get solder to form another connection in those spots now. I guess basically what I’m asking is, how does one clean up the U2 IC connections after removal of the old chip, and then how does one line up the new chip without crossing connections? It seems in most instructional videos, they skip the part where the clean it up. Any help is greatly appreciated!
I have a complete U2 video that I’m editing now that details this. It will appear on the iPad rehab YT channel. You use braid on the pads. And you let the chip align itself.
Use flux and quality solder wick. Make sure your equipment is getting hot enough and maintaining temperature. What size tip are you using? You will damage the pads on the board by either physically scratching them off or not using enough heat and pulling them off with the wick or chip. Don’t remove the wick without keeping adequate heat on it.
