Chosen Solution
Hi I recently took apart my MBA because of a coffee spill. Cleaned it up and it is up and working again. However, when I took apart the heat sink I put thermal paste on both the small square chip and the long rectangular chip. I had a feeling I should have only put the rectangular chip. Having put thermal paste on both will this be an issue or should I open it up and redo it?
You can only put TOO much thermal paste on if it’s over flowing and is on the board touching transistors or any part of the main board. Putting thermal paste between a heat sink and the component under it should be fine.
